Restriction of Hazardous Substances (RoHS)
Compucon has taken steps to request suppliers of components to comply with RoHS over time if not immediately. Compliant Compucon branded products are as stated below. Product codes pertain to motherboard or chassis. The date code is Year Month.
- The Restriction of Hazardous Substances Directive (RoHS) was adopted in February 2003 by the European Union and took effect from July 2006. It is a directive. This directive restricts the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment.
- Hexavalent chromium (Chromium VI or Cr6+)
- Polybrominated biphenyls (PBB)
- Polybrominated diphenyl ether (PBDE)
- Platinum 1U/2U Server: 6015B, 6025B since Oct 2006
- Platinum DXB Server & Workstation: Chassis W201 since July 2004, X7DAE & X7DBE since Oct 2006, W203 since June 2007
- Vanadium Server & Workstation: H8DA8, H8DAE, H8DCE since Oct 2006, H8DME & H8DAE2 since Aug 2007, W201 & W203 as above
- Workgroup SX Server: PDSME+ since Oct 2006, X7SBE since Jan 2008, W201 & W203 as above
- Superhawk & Thunderbird: Chassis 5409 since July 2004. 5411 inclusive of PSU since June 2007, Motherboard 187A, 187B & 1AP5KE since June 007
- Diamond & Jasper: Motherboard M2NPV since Nov 2006, P5GC-MX since Dec 2007, Chassis A201 since July 2004, A214 inclusive of PSU since June 2007, 1VNA since September 2007
In addition, the packaging material polystyrene used for protecting Compucon systems in transit is also RoHS compliant. (Update April 2010) The foam materials do not contain PVC and have been tested in laboratory as compliant with RoHC.
(Update September 2008) A Member of the Institution of Engineering and Technology has written to the Engineering & Technology magazine to point out that RoHS has produced a negative effect on the environment. In lieu of lead, the electronic industry has stepped up the use of tin.
(a) Tin is mined mainly from deposits in tropical rain forest areas. There is an increase in the destruction of valuable rain forests.
(b) The melting point of lead-free alloys is about 30C and higher than that of leaded alloys. Electricity consumption has increased for soldering, and this leads to increased carbon emission.