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March 2016 |
Key Features
- 5X Protection II – Advanced hardware safeguards for all-round protection
- Lightning-fast M.2 with PCIe® 3.0 x4 interface
- USB Type-C for convenient connectivity
- Epic gaming audio with noise-isolation design
- Media-acclaimed UEFI BIOS with EZ Flash 3
- Fan Xpert 2+ advanced fan controls for ultimate cooling and silent performance
Specifications
| CPU |
Intel® Socket 1151 for 6th Generation Core™ i7/Core™ i5/Core™ i3/Pentium®/Celeron® Processors
Supports Intel® 14 nm CPU
Supports Intel® Turbo Boost Technology 2.0
* The Intel® Turbo Boost Technology 2.0 support depends on the CPU types.
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| Chipset |
Intel® H170 |
| Memory |
4 x DIMM, Max. 64GB, DDR4 2133 MHz Non-ECC, Un-buffered Memory *
Dual Channel Memory Architecture
Supports Intel® Extreme Memory Profile (XMP)
* Hyper DIMM support is subject to the physical characteristics of individual CPUs.
* The maximum memory frequency supported varies by processor.
* Due to Intel® chipset limitation, DDR4 2133 MHz and higher memory modules on XMP mode will run at the maximum transfer rate of DDR4 2133 Mhz.
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| Graphic |
Integrated Graphics Processor- Intel® HD Graphics support
Multi-VGA output support : HDMI/DVI/DVI-D/RGB ports
- Supports HDMI with max. resolution 4096 x 2160 @ 24 Hz / 2560 x 1600 @ 60 Hz
- Supports DVI-D with max. resolution 1920 x 1200 @ 60 Hz
- Supports RGB with max. resolution 1920 x 1200 @ 60 Hz
Maximum shared memory of 1024 MB
Supports Intel® InTru™ 3D, Quick Sync Video, Clear Video HD Technology, Insider™
Supports up to 3 displays simultaneously |
| Multi-GPU Support |
Supports AMD Quad-GPU CrossFireX™ Technology
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| Expansion Slots |
1 x PCIe 3.0/2.0 x16 (x16 mode, gray)
1 x PCIe 3.0/2.0 x16 (max at x4 mode)
2 x PCIe 3.0/2.0 x1 |
| Storage |
Intel® H170 chipset :
1 x M.2 Socket 3, , with M key, type 2242/2260/2280 storage devices support (both SATA & PCIE mode)
1 x SATA Express port, gray, Compatible with 2 x SATA 6.0 Gb/s ports
6 x SATA 6Gb/s port(s), gray
Support Raid 0, 1, 5, 10
Supports Intel® Smart Response Technology*1
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| LAN |
Intel® I219V, 1 x Gigabit LAN Controller(s)
Intel® LAN- Dual interconnect between the Integrated LAN controller and Physical Layer (PHY)
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| Audio |
Realtek® ALC887 8-Channel High Definition Audio CODEC *2
- Supports : Jack-detection, Front Panel Jack-retasking
Audio Feature :
- Audio Shielding: Ensures precision analog/digital separation and greatly reduced multi-lateral interference
- Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals
- Premium Japanese-made audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity |
| USB Ports |
Intel® H170 chipset :
6 x USB 2.0/1.1 port(s) (2 at back panel, black, Type-A, 4 at mid-board)
Intel® H170 chipset :
6 x USB 3.0/2.0 port(s) (2 at back panel, blue, Type-A, 4 at mid-board)
Intel® H170 chipset :
1 x USB 5Gb/s port(s) port(s) (1 at back panel, black, Type-C, Reversible, Support 3A power output) |
| Back I/O Ports |
1 x PS/2 keyboard (purple)
1 x PS/2 mouse (green)
1 x DVI-D
1 x D-Sub
1 x HDMI
1 x LAN (RJ45) port(s)
1 x USB 5Gb/s port(s) Type-C ( support 3A power output )
2 x USB 3.0 (blue) Type-A
2 x USB 2.0
3 x Audio jack(s) |
Internal I/O Ports
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2 x USB 3.0 connector(s) support(s) additional 4 USB 3.0 port(s) (19-pin)
2 x USB 2.0 connector(s) support(s) additional 4 USB 2.0 port(s)
1 x SATA Express connector: gray, Compatible with 2 x SATA 6.0 Gb/s ports
1 x M.2 Socket 3
1 x TPM header
1 x LPT header
1 x COM port(s) connector(s)
6 x SATA 6Gb/s connector(s)
1 x CPU Fan connector(s) (1 x 4 -pin)
2 x Chassis Fan connector(s) (2 x 4 -pin)
1 x S/PDIF out header(s)
1 x 24-pin EATX Power connector(s)
1 x 8-pin ATX 12V Power connector(s)
1 x Front panel audio connector(s) (AAFP)
1 x System panel(s)
1 x Clear CMOS jumper(s) |
Form Factor
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mATX Form Factor
9.6 inch x 8.95 inch ( 24.4 cm x 22.7 cm ) |
Note
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*1: These functions will work depending on the CPU installed.
*2: Use a chassis with HD audio module in the front panel to support an 8-channel audio output. |
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