Menu Content/Inhalt
Home

GF STRIX RTX2080 OC 8GB GDDR6 Print
October 2018
ASUS ROG STRIX GeForce® RTX 2080 Overclocked 8G GDDR6 HDMI DP 1.4 USB Type-c
  • Auto Extreme Technology delivers premium quality and reliability with aerospace-grade Super Alloy Power II components.
  • Max-Contact Technology and 2.7 slot width provides 2x the surface area than the previous generation heatsink, allowing for more efficient thermal transfer.
  • Axial-Tech Fans increases airflow through the heatsink and boasts IP5X dust-resistance.
  • AURA Sync RGB lighting is capable of six lighting effects and millions of colors to allow you to express your style.
  • GPU Tweak II makes monitoring performance and streaming easier than ever, featuring Game Booster and XSplit Gamecaster, all via an intuitive interface.
RTX2080.PNG

Specifications


GPU Engine Specs
 CUDA Cores  2944
 Engine Clock
 (Default): GPU Boost Clock: 1860 MHz, GPU Base Clock: 1515 MHz
 (OC Mode): GPU Boost Clock: 1890 MHz, GPU Base Clock: 1515 MHz
   
Memory Specs
 Memory Clock  14000MHz
 Standard Memory Config  8GB
 Memory Interface  GDDR6
 Memory Interface Width  256-bit
   
Power
 Power Comsumption
 >215W, additional 8 + 8 pins PCIe power required
 PSU 650W+ required
   
Display Support
 Digital Max Resolution  7680 x 4320
 HDMI Output  Yes x 2 (Native) (HDMI 2.0b)
 Display Port  Yes x 2 (Native) (DP1.4)
 HDCP Support  Yes (2.2)
 USB Type-C Support
 Yes x 1 
   
Standard Graphics Card Dimensions
 Length  11.8 inches (29.97 cm)
 Height  5.13 inches (13.04 cm)
 Width  2.13 inches (5.41 cm)


Click here to return
 
RX560 4GB GDDR5 Print
October 2018
2ARX560.png
Key Features
  • Radeon RX560 plays your favorites at a smooth 1080p, from the latest eSports games and MOBAs to the most popular, graphically-intensive AAA titles. Built on the future-ready Polaris architecture and the card is ready for the latest technologies like DisplayPort 1.4 HBR3/HDR , HDMI 4K60, and Freesync 2 technology delivering a high level of graphical fidelity in your favorite games and multimedia experience.

Specifications

Graphics Engine AMD Radeon RX 560
Bus Standard PCI Express 3.0
OpenGL OpenGL®4.5
Video Memory GDDR5 4GB
Engine Clock 1175 MHz (Base)
1226 MHz (Boost)
Memory Clock 6000 MHz
Memory Interface 128-bit
Interface DVI Output : Yes x 1 (Native) (DVI-D)
HDMI Output : Yes x 1 (Native) (HDMI 2.0)
Display Port : Yes x 1 (Native) (Regular DP)
Resolution 5120×2880 (60Hz) Pixel DisplayPort Resolution
2560×1600(60Hz) Pixel Dual Link DVI Resolution

4096×2160 (60 Hz) HDMI Resolution
Power Connectors 1 x 6-pin
Power Consumption 75W
System Requirement 400 Watt Power Supply
Dimensions 2 Part Slot Occupied
210(L)X 112(W)X 36 (H) Dimension /mm


Click here to return
 
SSD 970 EVO NVMe 500GB Print
October 2018
Benefits
    The SSD that goes further
    Accelerate into next-gen computing. The latest V-NAND, new Phoenix controller, and Intelligent TurboWrite technology enhance high-end gaming and 4K & 3D graphic editing.

    Next level SSD speed
    Feel the NVMe difference. The 970 EVO transforms high-end gaming and streamlines graphic-intensive workflows with the new Phoenix controller and Intelligent TurboWrite technology. Get stunning sequential read/write speeds of 3,500/2,500 MB/s, up to 32% faster writes than the previous generation.

    Design Flexibility
    The next advancement in NVMe SSDs. The 970 EVO fits up to 2TB onto the compact M.2 (2280) form factor, greatly expanding storage capacity and saving space for other components. Samsung's innovative technology empowers you with the capacity to do more and accomplish more.

    Exceptional Endurance
    The new standard in sustainable performance. The 970 EVO provides exceptional endurance powered by the latest V-NAND technology and Samsung’s reputation for quality.

Specifications

  • Product Type/ Form Factor: NVMe M.2
  • Capacity: 500GB
  • Interface: PCIe 3.0 x4, NVMe 1.3
  • Sequential Write Speed: Up to 2,300 MB/sec
  • Sequential Read Speed: Up to 3,400 MB/sec
  • Controller: Samsung Phoenix controller
  • Endurance: 300TBW
  • Trim Support: Yes
  • NAND Flash: Samsung V-NAND 3-bit MLC
  • AES Encryption: AES 256-bit Encryption (Class 0)TCG/Opal IEEE1667 (Encrypted drive)
  • S.M.A.R.T. Support: Yes
  • GC (Garbage Collection): Auto Garbage Collection Algorithm
  • Device Sleep Mode Support: Yes
  • Internal Storage: Yes
  • Temperature proof: Yes
  • Power Consumption: Average: 5.7W, Idle: Max. 30 mW
  • Reliability (MTBF): 1.5 Million Hours Reliability (MTBF)
  • Operating Temperature: 32ºF - 158ºF (0ºC - 70ºC)
  • Dimensions (W x D x H): 3.16" x 0.09" x 0.87" (8.02 x 0.23 x 2.21 cm)
  • Weight: 0.0218 lbs (9.93g)

 

Click here to return

 
SSD 970 EVO NVMe 500GB Print
October 2018
Benefits
    The SSD that goes further
    Accelerate into next-gen computing. The latest V-NAND, new Phoenix controller, and Intelligent TurboWrite technology enhance high-end gaming and 4K & 3D graphic editing.

    Next level SSD speed
    Feel the NVMe difference. The 970 EVO transforms high-end gaming and streamlines graphic-intensive workflows with the new Phoenix controller and Intelligent TurboWrite technology. Get stunning sequential read/write speeds of 3,500/2,500 MB/s, up to 32% faster writes than the previous generation.

    Design Flexibility
    The next advancement in NVMe SSDs. The 970 EVO fits up to 2TB onto the compact M.2 (2280) form factor, greatly expanding storage capacity and saving space for other components. Samsung's innovative technology empowers you with the capacity to do more and accomplish more.

    Exceptional Endurance
    The new standard in sustainable performance. The 970 EVO provides exceptional endurance powered by the latest V-NAND technology and Samsung’s reputation for quality.

Specifications

  • Product Type/ Form Factor: NVMe M.2
  • Capacity: 500GB
  • Interface: PCIe 3.0 x4, NVMe 1.3
  • Sequential Write Speed: Up to 2,300 MB/sec
  • Sequential Read Speed: Up to 3,400 MB/sec
  • Controller: Samsung Phoenix controller
  • Endurance: 300TBW
  • Trim Support: Yes
  • NAND Flash: Samsung V-NAND 3-bit MLC
  • AES Encryption: AES 256-bit Encryption (Class 0)TCG/Opal IEEE1667 (Encrypted drive)
  • S.M.A.R.T. Support: Yes
  • GC (Garbage Collection): Auto Garbage Collection Algorithm
  • Device Sleep Mode Support: Yes
  • Internal Storage: Yes
  • Temperature proof: Yes
  • Power Consumption: Average: 5.7W, Idle: Max. 30 mW
  • Reliability (MTBF): 1.5 Million Hours Reliability (MTBF)
  • Operating Temperature: 32ºF - 158ºF (0ºC - 70ºC)
  • Dimensions (W x D x H): 3.16" x 0.09" x 0.87" (8.02 x 0.23 x 2.21 cm)
  • Weight: 0.0218 lbs (9.93g)

 

Click here to return

 
Debut of EPYC as a Compucon Server Series Print
October 2018
2018-1020 First posted

A new server processor, the EPYC series from AMD, has been available in the supply chain for more than a year now and this processor has not been picked up on this forum previously until now. Should we know about this processor series? Why did this forum not discuss it till now?

Intel Xeon processors have dominated the market for over a decade and so the emergence of a new server processor from AMD might be considered an event but not an advent. AMD recently published a theoretical study indicating that EYPC would achieve the same or higher level of performance and productivity than Xeon for the same or less price in terms of Total Cost of Ownership (TCO). Though it was a marketing piece, it did contain enough arguments to support its claims. Perhaps it is a wake-up call to the market and so this forum wakes up. Ref: https://www.nextplatform.com/2018/09/27/virtualization-is-the-real-opportunity-for-epyc/

EPYC is a multi-chip module processor meaning that the processor is not made of one die but is a package of multiple dies. This approach allows more processor cores to be packaged without incurring the high cost of fabricating high core density dies. The concept may be simple, but can it be implemented well in practice?

This is what the Compucon team has done recently by hands-on benchmark testing (in September and October 2018) to find out the productivity of the implementation. The test sample is the EYPC 7351P- single socket, 16 cores, 32 threads, 64MB L3, and 2.4GHz base frequency supporting 8 channels of DDR4 memory transfer and 128 PCIe links with a TDP of 155W. It is made from a 14nm manufacturing process. This specification is very impressive.

Compucon tested the EPYC with a popular open source scientific and mathematical application called Cholesky Factorization. The runtime using 16 cores achieved a speed up of 15.8 times over 1 core. This is a very high score; though not a perfect score, perfection is not achievable in real life. In fact, this application requires data to be transferred between cores before computing can proceed during the entire computing process, and data transfer took up some clock time. If the application does not need inter-core data transfers, the speed up may reach 15.99 or something along those. The test result confirms that the multi-chip packaging arrangement has not introduced extra latency to computation and this is good.

EPYC has 2 other merits over Xeon. One is the higher memory bandwidth from 8 channels. Xeon has 6 channels only. The other one is the support of 128 PCIe links by a single socket processor. This quantity is higher than that supplied by 2 Xeon sockets. A GPU card needs 16 of them, so a single socket motherboard has more than enough bandwidth to support 4 GPU cards and more, subject to the real estate of the motherboard form factor and the intended design criteria decided by the motherboard maker.

All in all, EPYC is impressive.
 
<< Start < Prev 31 32 33 34 35 36 37 38 39 40 Next > End >>

Results 316 - 324 of 2511