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October 2017 |
2015-11 Why we changed Jasper to APU? -
Motherboard - AMD B450 chipset -
CPU - AMD Athlon Processor -
RAM - DDR4 Dual Channel Memory -
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Video - Integrated VGA based on Radeon R7 series -
Audio - Realtek ALC 887 8-Channel High Definition Audio -
LAN - Gigabit Ethernet -
HDD - 7200rpm SATA NCQ/IDE -
DVD-RW - 24x SATA DVD Writer -
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Monitor - 19"-24" Wide or Standard 4:3 LCD screen -
Software - Windows 10 or 7, ESET Smart Security - Jasper IO port Diagram
This model is designed for standard office, education, and general applications such as accounting, secretarial, clerical, checkout, inventory control, learning and research etc. The AMD B450 chipset has an integrated Integrated VGA based on Radeon Vega 3 GPU which provides full 1080p HD video support as well as for gaming and multimedia applications. A 16x PCI Express 3.0/2.0 slot is also present if increased graphics performance is required with a Hybrid CrossfireX option if a compatible card is used. This system can support up to 64GB of DDR4 memory in its four (4) DIMM sockets (with two banks providing dual-channel performance). The system is housed in a Slim Micro ATX form factor case which complies with MEPS(80 PLUS GOLD Certified PSU). Please note that only about 3.2GB of memory will be registered and used in 32-bit versions of Windows XP/7. A 64-bit OS is required if your needs 4GB of memory or more. Many special features are supported by this system, but not necessarily included in the base configuration. Please ugprade as desired. Notable features are: Please contact your IT consultant or Compucon
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for more technical and pricing information. |
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October 2017 |
| SPECIFICATIONS |
| Case
dimension |
333mm W x 383mm D x 96mm H
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| Motherboard
configuration |
Micro ATX, DTX |
| CPU Heatsink Fan support |
82mm or less in height |
| Drive
configuration |
4 Drive Bays
1- 5.25"
3- 3.50" (2 Hidden)
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| System Cooling Fan |
1 * 80x15mm DC fan front-mounted
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| Front Panel Control |
Power switch, Power LED, HDD LED
USB 3.0*2+AC97 or HD AUDIO
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| Materials |
Recyclable materials; Steel chassis
Flame retardant plastic parts and front bezel(HB) |
| Emissions |
Designed to meet FCC class B-47 CFR part15/IEC/CISPR 22:1993 |
| Net Weight |
3Kgs |
| Colour |
Black Chassis /Black Bezel with Black Mesh |
| Power Supply |
TFX 300W
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October 2017 |
Product Info:
| Product Name |
Hyper 212X |
| Model |
RR-212X-20PM-R1 |
| CPU Socket |
Intel® LGA 2066 / 2011-3 / 2011 / 1366 / 1156 / 1155 / 1151 / 1150 socket
AMD® AM4* / AM3+ / AM3 / AM2+ / AM2 / FM2+ / FM2 / FM1 socket |
| Dimensions |
120 x 79 x 158 mm / 4.7 x 3.1 x 6.2 inch
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| Heat Sink Dimensions |
116 x 51 x 158 mm / 4.6 x 2.0 x 6.2 inch |
| Heat Sink Weight |
492g / 1.1lb
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| Fan Speed |
600 - 2,000 RPM (PWM) ± 10%
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| Connector |
4-Pin |
| Rated Voltage |
12 VDC
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| Power Consumption |
4.44W (max) |
| Fan Noise Level (dB-A) |
9 - 36 dBA
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October 2017 |
Product Info:
| Product Name |
Deepcool Gammaxx 400 |
| Model |
GAMMAXX 400 |
| CPU Socket |
LGA20XX/LGA1366/LGA115X/LGA1150/LGA1151/LGA775 socket
AM4/FM2+/FM2/FM1/AM3+/AM3/AM2+/AM2 socket |
| Dimensions |
135X80X154.5mm
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| Fan Dimensions |
120X120X25mm |
| Heat Sink Weight |
670g
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| Fan Speed |
900±150~1500±10%RPM
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| Connector |
4-Pin |
| Rated Voltage |
12 VDC
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| Power Consumption |
3.0W |
| Fan Noise Level (dB-A) |
17.8~30dB(A)
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October 2017 |
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Compucon Roofline Capability
A PC is a PC --> Wrong!
This capability is based on a technical paper published by the University of California at Berkeley in 2009 entitled “Roofline: An Insightful Visual Performance Model for Multicore Architectures”. The model offers insight on how to improve the performance of multicore microprocessors and how to choose processors for high performance computing.
In brief, an algorithm that is written for parallel computing has a certain amount of computation workload and a certain amount of data access in order to carry out the computation in a processor. The ratio of computation workload and data access is given the term “arithmetic intensity” or “operation intensity”. The ratio has been shown to be pivotal in deciding if a given computer processor is fit for the algorithm or otherwise.
Roofline is a visual representation of the capability of computer processor. It is plotted on a graph which has the arithmetic intensity on the horizontal axis and the computation capability on the vertical axis. Contrary to what most people may think, a given processor does not have a fixed computational capability as designed by the hardware vendor for all types of algorithms. Instead the peak hardware computation capability is accessible to an algorithm only if the algorithm has a higher arithmetic intensity than the roofline ridge of the hardware. The roofline is the peak capability built into the hardware, whereas the ridge is where the peak drops off to a lower level. The drop off point is called the roofline ridge. A rule of thumb is that the roofline is flat for high arithmetic intensity and is slant (slope) for low arithmetic intensity. This reveals a very important point for computing system engineers to specify the type of processor to match the algorithm.
The concept is simple but the application is not as simple. Microprocessor designers are the biggest group of people having an interest in this model. High performance system engineers would be the second main group of interested people.
Compucon has grasped this concept and applied it to matching processors with algorithms successfully. Unfortunately, all shrink-wrapped software applications are close-sourced and how the code was written could not be examined as for open-sourced code. That is, hardware matching for shrink-wrapped would have to be done by trial and error whereas the match could be predicted for open-source.
Compucon has further applied this concept to the international Square Kilometre Array (SKA) Science Data Processor (SDP) design investigation. At the time of writing, we have proposed a model for predicting the computational profile of a pipeline of applications. Pipeline refers to a specific sequence of application modules that have to be executed for achieving the solution, and the sequence or module may be adjusted when more insight is obtained. The proposed model serves the function as the conventional meaning of model, that is, to get some idea of what will happen before we invest in the full scale system and to avoid the risk of dumping the full investment down the drain.
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