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Compucon Jasper Workstation Print
October 2017

  • 2015-11 Why we changed Jasper to APU?
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    This model is designed for standard office, education, and general applications such as accounting, secretarial, clerical, checkout, inventory control, learning and research etc.  The AMD B450 chipset has an integrated Integrated VGA based on Radeon Vega 3 GPU which provides full 1080p HD video support as well as for gaming and multimedia applications. A 16x PCI Express 3.0/2.0 slot is also present if increased graphics performance is required with a Hybrid CrossfireX option if a compatible card is used.  This system can support up to 64GB of DDR4 memory in its four (4) DIMM sockets (with two banks providing dual-channel performance). The system is housed in a Slim Micro ATX form factor case which complies with MEPS(80 PLUS GOLD Certified PSU).

    Please note that only about 3.2GB of memory will be registered and used in 32-bit versions of Windows XP/7. A 64-bit OS is required if your needs 4GB of memory or more.

    Many special features are supported by this system, but not necessarily included in the base configuration. Please ugprade as desired. Notable features are:

    • Ultimate 10Gbit/s USB 3.1 Gen 2 onboard
    • Epic gaming audio with LED-illuminated shielding
    • Six SATA 6Gb/s drives with RAID-1, RAID-0 or RAID 10 (Host)

    Please contact your IT consultant or Compucon  This e-mail address is being protected from spam bots, you need JavaScript enabled to view it  for more technical and pricing information.

     

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    Compucon Slim Micro Case - 7C730U3 Print
    October 2017
      Chassis with Feet + Installation | Thermal Solution
     7C730

    SPECIFICATIONS
    Case dimension
    333mm W x 383mm D x 96mm H
    Motherboard configuration Micro ATX, DTX
    CPU Heatsink Fan support 82mm or less in height
    Drive configuration
    4 Drive Bays
    1- 5.25"
    3- 3.50" (2 Hidden)
    System Cooling Fan
    1 * 80x15mm DC fan front-mounted
    Front Panel Control Power switch, Power LED, HDD LED
    USB 3.0*2+AC97 or HD AUDIO

    Materials Recyclable materials; Steel chassis
    Flame retardant plastic parts and front bezel(HB)
    Emissions Designed to meet FCC class B-47 CFR part15/IEC/CISPR 22:1993
    Net Weight 3Kgs
    Colour Black Chassis /Black Bezel with Black Mesh
    Power Supply TFX 300W

     7C730  7C730 Right
     7C730 Left  7C730 Left Side
     7C730 Front



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    HEATSINK FAN FOR INTEL/AMD Print
    October 2017
    1CFAND.PNG

    Product Info:

     Product Name Hyper 212X
     Model RR-212X-20PM-R1
    CPU Socket Intel® LGA 2066 / 2011-3 / 2011 / 1366 / 1156 / 1155 / 1151 / 1150 socket AMD® AM4* / AM3+ / AM3 / AM2+ / AM2 / FM2+ / FM2 / FM1 socket
    Dimensions 120 x 79 x 158 mm / 4.7 x 3.1 x 6.2 inch
    Heat Sink Dimensions 116 x 51 x 158 mm / 4.6 x 2.0 x 6.2 inch
    Heat Sink Weight 492g / 1.1lb
    Fan Speed 600 - 2,000 RPM (PWM) ± 10%
    Connector 4-Pin
    Rated Voltage 12 VDC
    Power Consumption 4.44W (max)
    Fan Noise Level (dB-A) 9 - 36 dBA


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    HEATSINK FAN FOR INTEL/AMD Print
    October 2017
    1CFAND.jpg

    Product Info:

     Product Name Deepcool Gammaxx 400
     Model GAMMAXX 400
    CPU Socket LGA20XX/LGA1366/LGA115X/LGA1150/LGA1151/LGA775 socket
    AM4/FM2+/FM2/FM1/AM3+/AM3/AM2+/AM2 socket
    Dimensions 135X80X154.5mm
    Fan Dimensions 120X120X25mm
    Heat Sink Weight 670g
    Fan Speed 900±150~1500±10%RPM
    Connector 4-Pin
    Rated Voltage 12 VDC
    Power Consumption 3.0W
    Fan Noise Level (dB-A) 17.8~30dB(A)


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    2017-10 Compucon Roofline Capabilities Print
    October 2017

    Compucon Roofline Capability

    A PC is a PC --> Wrong!

    This capability is based on a technical paper published by the University of California at Berkeley in 2009 entitled “Roofline: An Insightful Visual Performance Model for Multicore Architectures”.  The model offers insight on how to improve the performance of multicore microprocessors and how to choose processors for high performance computing.

    In brief, an algorithm that is written for parallel computing has a certain amount of computation workload and a certain amount of data access in order to carry out the computation in a processor.  The ratio of computation workload and data access is given the term “arithmetic intensity” or “operation intensity”.  The ratio has been shown to be pivotal in deciding if a given computer processor is fit for the algorithm or otherwise. 

    Roofline is a visual representation of the capability of computer processor.  It is plotted on a graph which has the arithmetic intensity on the horizontal axis and the computation capability on the vertical axis.  Contrary to what most people may think, a given processor does not have a fixed computational capability as designed by the hardware vendor for all types of algorithms.  Instead the peak hardware computation capability is accessible to an algorithm only if the algorithm has a higher arithmetic intensity than the roofline ridge of the hardware.  The roofline is the peak capability built into the hardware, whereas the ridge is where the peak drops off to a lower level.  The drop off point is called the roofline ridge.  A rule of thumb is that the roofline is flat for high arithmetic intensity and is slant (slope) for low arithmetic intensity.  This reveals a very important point for computing system engineers to specify the type of processor to match the algorithm. 

    The concept is simple but the application is not as simple.  Microprocessor designers are the biggest group of people having an interest in this model.  High performance system engineers would be the second main group of interested people.

    Compucon has grasped this concept and applied it to matching processors with algorithms successfully.  Unfortunately, all shrink-wrapped software applications are close-sourced and how the code was written could not be examined as for open-sourced code.  That is, hardware matching for shrink-wrapped would have to be done by trial and error whereas the match could be predicted for open-source.

    Compucon has further applied this concept to the international Square Kilometre Array (SKA) Science Data Processor (SDP) design investigation. At the time of writing, we have proposed a model for predicting the computational profile of a pipeline of applications.  Pipeline refers to a specific sequence of application modules that have to be executed for achieving the solution, and the sequence or module may be adjusted when more insight is obtained.  The proposed model serves the function as the conventional meaning of model, that is, to get some idea of what will happen before we invest in the full scale system and to avoid the risk of dumping the full investment down the drain.


     

     
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