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COOLER MASTER HEATSINK FAN FOR INTEL/AMD Print
July 2017
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Product Info:

 Product Name Hyper 103
 Model RR-H103-22PB-R1
CPU Socket Intel® LGA 2066 / 2011-3 / 2011 / 1366 / 1156 / 1155 / 1151 / 1150 / 775, AMD FM2+ / FM2 / FM1 / AM3+ / AM3 / AM2
Dimensions 108 x 89.5 x 138.5 mm (4.3 x 3.5 x 5.5 in)
Heat Sink Dimensions 96 x 61 x 138.5 mm (3.8 x 2.4 x 5.5 in)
Heat Sink Weight 500 g / 1.1 lb
Fan Speed 800~2,200 RPM (PWM) ± 10%
Connector 4-Pin
Rated Voltage 12 VDC
Power Consumption 1.8 W


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Intel Core i7-7800X Processor (8.25M Cache, up to 4.00 GHz) Print
July 2017

Specifications

Essentials
Status
Launched
Launch Date
Q2 '17
Processor Number
i7-7800X
Cache
8.25 MB
Instruction Set
64-bit
Embedded Options Available
No
Lithography
14 nm
   
Performance
Number of Cores
6
Number of Threads
12
Processor Base Frequency
3.5 GHz
Max Turbo Frequency
4.0 GHz
TDP
140 W
Memory Specifications
Max Memory Size (dependent on memory type)
128 GB
Memory Types
DDR4 2400
Max # of Memory Channels
4
ECC Memory Supported
No
Expansion Options
PCI Express Revision
3.0
Max # of PCI Express Lanes
28
   
Package Specifications
Max CPU Configuration
1
Sockets Supported
FCLGA2066
Advanced Technologies
Intel® Optane™ Memory Supported Yes
Intel® Turbo Boost Technology 2.0
Intel® Hyper-Threading Technology No
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® 64 Yes
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX 2.0, AVX-512
Enhanced Intel SpeedStep® Technology Yes
   
Intel Data Protection Technology
AES New Instructions
Yes
   
Intel Platform Protection Technology
Execute Disable Bit
Yes
Trusted Execution Technology
No

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Intel Core i7-7820X Processor (11M Cache, up to 4.30 GHz) Print
July 2017

Specifications

Essentials
Status
Launched
Launch Date
Q2 '17
Processor Number
i7-7820X
Cache
11 MB
Instruction Set
64-bit
Embedded Options Available
No
Lithography
14 nm
   
Performance
Number of Cores
8
Number of Threads
16
Processor Base Frequency
3.6 GHz
Max Turbo Frequency
4.3 GHz
TDP
140 W
Memory Specifications
Max Memory Size (dependent on memory type)
128 GB
Memory Types
DDR4 2666
Max # of Memory Channels
4
ECC Memory Supported
No
Expansion Options
PCI Express Revision
3.0
Max # of PCI Express Lanes
28
   
Package Specifications
Max CPU Configuration
1
Sockets Supported
FCLGA2066
Advanced Technologies
Intel® Optane™ Memory Supported Yes
Intel® Turbo Boost Max Technology 3.0 Yes
Intel® Turbo Boost Technology 2.0
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® 64 Yes
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX 2.0, AVX-512
Enhanced Intel SpeedStep® Technology Yes
   
Enhanced Intel SpeedStep® Technology
AES New Instructions
Yes
   
Intel Platform Protection Technology
Execute Disable Bit
Yes

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M/BOARD PRIME X299-A Print
July 2017
Key Features
  • 5-Way Optimization: One-click, system-wide tuning, delivering optimized overclocks and intelligent cooling for CPU or GPU-intensive tasks
  • Industry-leading cooling options: Comprehensive controls for fans and water pumps, via Fan Xpert 4 software or the acclaimed ASUS UEFI
  • M.2 heatsink: Ultra-efficient heatsink reduces M.2 SSD temperatures by up to 20°C for unthrottled SSD storage speeds and enhanced reliability
  • Aura Sync: Controllable onboard RGB lighting that’s easily synced with an ever-growing portfolio of Aura-capable hardware

Specifications

CPU

Intel® Socket 2066 Core™ X-Series Processors
* The Intel® Turbo Boost Max Technology 3.0 support depends on the CPU types

Chipset

Intel® X299

Memory

Intel® Core™ X-series Processors (6-core above)
8 x DIMM, Max. 128GB, DDR4 4000(O.C.)/3600(O.C.)/2666/2400/2133 MHz Non-ECC, Un-buffered Memory
Intel® Core™ X-series Processors (4-core)
4 x DIMM, Max. 64GB, DDR4 4000(O.C.)/3600(O.C.)/2666/2400/2133 MHz Non-ECC, Un-buffered Memory
* Hyper DIMM support is subject to the physical characteristics of individual CPUs.

Multi-GPU Support

Supports NVIDIA® Quad-GPU SLI™ Technology
Supports NVIDIA® 3-Way SLI™ Technology
Supports NVIDIA® 2-Way SLI™ Technology
Supports AMD Quad-GPU CrossFireX™ Technology
Supports AMD 3-Way CrossFireX™ Technology

Expansion Slots

44-Lane CPU-
3 x PCIe 3.0/2.0 x16 (x16, x16/x16, x16/x16/x8)
2 x PCIe 3.0 x4 (max at x4 mode) *1
1 x PCIe 3.0/2.0 x1 *3
28-Lane CPU-
3 x PCIe 3.0/2.0 x16 (x16, x16/x8, x16/x8/x1) *4
2 x PCIe 3.0 x4 (max at x4 mode) *1
1 x PCIe 3.0/2.0 x1 *3
16-Lane CPU-
3 x PCIe 3.0/2.0 x16 (x16, x8/x8, x8/x8/x1) *4
2 x PCIe 3.0 x4 (max at x4 mode) *1
1 x PCIe 3.0/2.0 x1 *3
1 x PCIe 3.0/2.0 x1 (x1 mode)

Storage

Intel® X299 Chipset :
1 x M.2 x4 Socket 3, with M key, type 2242/2260/2280 storage devices support (SATA & PCIE 3.0 x 4 mode)
1 x M.2 x4 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode)
8 x SATA 6Gb/s port(s)
Support Raid 0, 1, 5, 10
Supports Intel® Smart Response Technology, Intel Rapid Start Technology
Intel® Optane™ Memory Ready

LAN

Intel® I219V, 1 x Gigabit LAN Controller(s), featuring Turbo LAN
ASUS Turbo LAN Utility
ASUS LAN Guard

Audio

Realtek® ALC S1220A 8-Channel High Definition Audio CODEC
- Impedance sense for front and rear headphone outputs
- Internal audio Amplifier to enhance the highest quality sound for headphone and speakers
- Supports : Jack-detection, Multi-streaming, Front Panel Jack-retasking
Audio Feature :
- DTS Connect
- DTS Headphone:X
- Optical S/PDIF out port(s) at back panel
- Audio Shielding: Ensures precision analog/digital separation and greatly reduced multi-lateral interference
- Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals
- Premium Japanese-made audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity
- Unique de-pop circuit: Reduces start-up popping noise to audio outputs
- EMI protection cover to prevent electrical noise to affect the amplifier quality
Separate layer for left and right track, ensuring both sound deliver equal quality

USB Ports

ASMedia® USB 3.1 Gen 2 controller :
1 x USB 3.1 Gen 2 port(s) (1 at mid-board)
2 x USB 3.1 Gen 2 port(s) (Type-A + USB Type-CTM)
Intel® X299 Chipset:
8 x USB 3.1 Gen 1 port(s) (4 at back panel, , 4 at mid-board)
4 x USB 2.0 port(s) (4 at back panel, , 2 at mid-board)

Back I/O Ports

1 x LAN (RJ45) port(s)
2 x USB 3.1 Gen 2 Type-A + USB Type-CTM
4 x USB 3.1 Gen 1
2 x USB 2.0 (one port can be switched to USB BIOS Flashback)
1 x Optical S/PDIF out
5 x Audio jack(s)
1 x USB BIOS Flashback Button(s)

Internal I/O Ports

1 x AAFP connector
2 x Aura RGB Strip Header
2 x USB 3.1 Gen 1 connector(s) support(s) additional 4 USB 3.1 Gen 1 port(s)
1 x USB 2.0 connector(s) support(s) additional 2 USB 2.0 port(s)
1 x M.2 Socket 3 with M key, type 2242/2260/2280 storage devices support (SATA & PCIE 3.0 x 4 mode)
1 x M.2 Socket 3 with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode)
8 x SATA 6Gb/s connector(s)
1 x M.2_FAN connector
1 x VROC_HW_Key
1 x CPU Fan connector(s)
1 x CPU OPT Fan connector(s)
2 x Chassis Fan connector(s)
1 x AIO_PUMP connector
1 x W_PUMP+ connector
1 x Thunderbolt header(s)
1 x 24-pin EATX Power connector(s)
1 x 8-pin ATX 12V Power connector(s)
1 x 4-pin ATX 12V Power connector(s)
1 x System panel(s) (Q-Connector)
1 x 5-pin EXT_FAN(Extension Fan) connector
1 x MemOK! button(s)
1 x Thermal sensor connector(s)
1 x Power-on button(s)
1 x Clear CMOS jumper(s)
1 x USB 3.1 Gen 2 front panel connector
1 x CPU_OV jumper

Form Factor

ATX Form Factor
12 inch x 9.6 inch ( 30.5 cm x 24.4 cm )

Note:

1. PCIEX4_1 max. at x1 mode, PCIEX4_2 max. at x4 mode
2. SATA6G_5/6/7/8 share bandwidth with PCIEX4_2.
3. PCIEX1_1 shares bandwidth with Front USB 3.1 GEN 2
4. PCIEX16_3 share bandwidth with PCIEX4_1 when using x28 or x16 lane CPU

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Intel Core i9-7900X Processor (13.75M Cache, up to 4.30 GHz) Print
July 2017

Specifications

Essentials
Status
Launched
Launch Date
Q2 '17
Processor Number
i9-7900X
Cache
13.75 MB
Instruction Set
64-bit
Embedded Options Available
No
Lithography
14 nm
   
Performance
Number of Cores
10
Number of Threads
20
Processor Base Frequency
3.3 GHz
Max Turbo Frequency
4.3 GHz
TDP
140 W
Memory Specifications
Max Memory Size (dependent on memory type)
128 GB
Memory Types
DDR4 2666
Max # of Memory Channels
4
ECC Memory Supported
No
Expansion Options
PCI Express Revision
3.0
Max # of PCI Express Lanes
44
   
Package Specifications
Max CPU Configuration
1
Sockets Supported
FCLGA2066
Advanced Technologies
Intel® Optane™ Memory Supported Yes
Intel® Turbo Boost Max Technology 3.0 Yes
Intel® Turbo Boost Technology 2.0
Intel® Hyper-Threading Technology Yes
Intel® Virtualization Technology (VT-x) Yes
Intel® Virtualization Technology for Directed I/O (VT-d) Yes
Intel® 64 Yes
Instruction Set 64-bit
Instruction Set Extensions SSE4.1/4.2, AVX 2.0, AVX-512
Enhanced Intel SpeedStep® Technology Yes
   
Enhanced Intel SpeedStep® Technology
AES New Instructions
Yes
   
Intel Platform Protection Technology
Execute Disable Bit
Yes

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