|
April 2016 |
Experience low total cost of ownership and exceptional performance, reliability, and strong data protection with the Intel® Solid-State Drive Data Center S3510 Series. The Intel SSD DC S3510 Series optimizes data centers, cloud, and intelligent systems running read-intensive applications such as boot, web servers, operational databases, and analytics.
The Intel SSD DC S3510 Series accelerates data center performance with read/write throughput speeds up to 500/460 megabytes per second (MB/s) and 4K random read/write input/output operations per second (IOPs) up to 68,000/20,000. Applications benefit from 55 μs typical latency with max read latencies of 500 μs 99.9 percent of the time.
Combining performance with low typical active power (less than 5.6 watts) the Intel SSD DC S3510 Series meets the demanding needs of the data center with low total cost of ownership, ideal for server or application upgrades.
Key features and benefits of this drive include an Intel® 3rd generation controller,industry-leading 16nm multi-level cell (MLC) NAND flash memory with Standard Endurance Technology(SET), Stress Free Data Protection and Power-Efficient Performance.
|
|
| Capacity | Sequential Read/Write (up to)1 | Random 4KB Read (up to)/Write (up to)2
| Enhanced Power Loss Data Protection | Hardware Encryption | Temperature Monitoring and Logging | End-to-End Data Protection |
| 120GB |
SATA 6 Gb/s
475 / 135 MB/s |
68,000 / 5,300 IOPS
|
Yes |
AES 256 bit
|
Yes |
Yes
|
240GB
|
SATA 6 Gb/s
500 / 260 MB/s
|
68,000 / 10,200 IOPS |
Yes |
AES 256 bit
|
Yes
|
Yes
|
480GB
|
SATA 6 Gb/s
500 / 440 MB/s |
68,000 / 15,100 IOPS |
Yes |
AES 256 bit
|
Yes |
Yes
|
800GB
|
SATA 6 Gb/s
500 / 460 MB/s
|
67,000 / 15,300 IOPS |
Yes |
AES 256 bit
|
Yes
|
Yes
|
1.2TB
|
SATA 6 Gb/s
500 / 440 MB/s
|
67,000 / 20,000 IOPS |
Yes |
AES 256 bit
|
Yes
|
Yes
|
1.6TB
|
SATA 6 Gb/s
500 / 430 MB/s
|
65,000 / 15,200 IOPS |
Yes |
AES 256 bit
|
Yes
|
Yes
|
1. Based on the Intel® SSD DC S3510 Series Product Specification.
2. Performance measured using Iometer* with 4K Random Writes QD=32 on a full Logical Block Address (LBA) span of the drive.
Click here to return
|
|
|
April 2016 |
Product Info:
| Product Name |
DDR4-2133
|
| Capacity |
4G/8G |
| Memory Architecture |
x8 DRAM chip
|
| Voltage |
1.2V
|
| Height |
288Pin Unbuffered-DIMM
|
| Bandwidth |
17000 MB/s
|
| Pin |
288 |
| Cas Latency |
CL15 |
| Standard OP Temp(℃) |
0~+85
|
| JEDEC Standard |
Yes |
| RoHS Compliant |
Yes
|
Click here to return
|
|
|
April 2016 |
|
The 6th generation Intel® Core™ processor family is manufactured on Intel's latest 14 nm technology. Paired with the Intel® 100 series chipset, these processors offer dramatically higher CPU and graphics performance as compared to the previous generation, a broad range of power options, and new advanced features to boost performance for edge-to-cloud Internet of Things (IoT) designs. The 6th generation Intel Core processor family maintains a standardized thermal envelope for 65W and 35W desktop products remaining consistent with the previous processor generation and are an ideal low-power option for manufacturing flexibility.
The date of release and performance specification is shown in the table below.
"Skylake" (14 nm)
Skylake is the codename for the Intel® processor microarchitecture that is the successor to the Broadwell microarchitecture. Skylake is built on Intel’s 14 nm manufacturing process and delivers breakthroughs in performance and power efficiency over previous generation microarchitectures for high performance graphics, stunning high-resolution video playback, great system performance and responsiveness, even longer battery life, and stronger security.
The major changes between the Haswell and Skylake architectures include the removal of the fully integrated voltage regulator (FIVR) introduced with Haswell. On the variants that will use a discrete Platform Controller Hub (PCH), Direct Media Interface (DMI) 2.0 is replaced by DMI 3.0, which allows speeds of up to 8 GT/s.
Architecture:
- Improved front-end, deeper out-of-order buffers, improved execution units, more execution units(third vector integer ALU(VALU)), more load/store bandwidth, improved hyper-threading (wider retirement), speedup of AES-GCM and AES-CBC by 17% and 33% accordingly.
- 14 nm manufacturing process
- LGA 1151 socket for desktop processors
- 100 Series chipset (Sunrise Point)
- Thermal design power (TDP) up to 95 W (LGA 1151)
- Support for both DDR3L SDRAM and DDR4 SDRAM in mainstream variants, using custom UniDIMM SO-DIMM form factor with up to 64 GB of RAM on LGA 1151 variants. Usual DDR3 memory is also supported by certain motherboard vendors even though Intel doesn't officially support it.
- Support for 16 PCI Express 3.0 lanes from CPU, 20 PCI Express 3.0 lanes from PCH (LGA 1151)
- Support for Thunderbolt 3 (Alpine Ridge)
- 64 to 128 MB L4 eDRAM cache on certain SKUs
- Up to four cores as the default mainstream configuration
- Intel MPX (Memory Protection Extensions)
- Intel SGX (Software Guard Extensions)
- Intel Speed Shift
- Skylake's integrated Gen9 GPU supports Direct3D 12 at the feature level 12_1
- Full fixed function HEVC Main/8bit encoding/decoding acceleration. Hybrid/Partial HEVC Main10/10bit decoding acceleration. JPEG encoding acceleration for resolutions up to 16,000×16,000 pixels. Partial VP9 encoding/decoding acceleration.
|
 |
| Model Number |
Cores |
Frequency |
Turbo-Quad |
L3 Cache |
GPU Model |
GPU Frequency |
TDP |
Socket |
Release Date |
Core i3
|
| Core i3-6100 |
2(4 Threads)
|
3.7 GHz |
N/A
|
3 MB |
HD 530 |
350–1050 MHz |
51 W |
LGA 1151 |
Oct,2015 |
Core i5
|
| Core i5-6400 |
4(4 Threads)
|
2.7 GHz |
3.1 GHz
|
6 MB |
HD 530 |
350–950 MHz |
65 W |
LGA 1151 |
Aug,2015 |
| Core i5-6600 |
4(4 Threads)
|
3.3 GHz |
3.6 GHz
|
6 MB |
HD 530 |
350–1150 MHz |
65 W |
LGA 1151 |
Sept, 2015 |
| Core i5-6600K |
4(4 Threads)
|
3.5 GHz |
3.6 GHz
|
6 MB |
HD 530 |
350–1150 MHz |
91 W |
LGA 1151 |
Aug, 2015 |
Core i7
|
| Core i7-6700 |
4(8 Threads)
|
3.4 GHz |
3.7 GHz
|
8 MB |
HD 530 |
350–1150 MHz |
65 W |
LGA 1151 |
Sept, 2015 |
| Core i7-6700K |
4(8 Threads)
|
4.0 GHz |
4.0 GHz
|
8 MB |
HD 530 |
350–1150 MHz |
91 W |
LGA 1151 |
Aug, 2015 |
Click here to return
|
|
|
April 2016 |
|
The 6th generation Intel® Core™ processor family is manufactured on Intel's latest 14 nm technology. Paired with the Intel® 100 series chipset, these processors offer dramatically higher CPU and graphics performance as compared to the previous generation, a broad range of power options, and new advanced features to boost performance for edge-to-cloud Internet of Things (IoT) designs. The 6th generation Intel Core processor family maintains a standardized thermal envelope for 65W and 35W desktop products remaining consistent with the previous processor generation and are an ideal low-power option for manufacturing flexibility.
The date of release and performance specification is shown in the table below.
"Skylake" (14 nm)
Skylake is the codename for the Intel® processor microarchitecture that is the successor to the Broadwell microarchitecture. Skylake is built on Intel’s 14 nm manufacturing process and delivers breakthroughs in performance and power efficiency over previous generation microarchitectures for high performance graphics, stunning high-resolution video playback, great system performance and responsiveness, even longer battery life, and stronger security.
The major changes between the Haswell and Skylake architectures include the removal of the fully integrated voltage regulator (FIVR) introduced with Haswell. On the variants that will use a discrete Platform Controller Hub (PCH), Direct Media Interface (DMI) 2.0 is replaced by DMI 3.0, which allows speeds of up to 8 GT/s.
Architecture:
- Improved front-end, deeper out-of-order buffers, improved execution units, more execution units(third vector integer ALU(VALU)), more load/store bandwidth, improved hyper-threading (wider retirement), speedup of AES-GCM and AES-CBC by 17% and 33% accordingly.
- 14 nm manufacturing process
- LGA 1151 socket for desktop processors
- 100 Series chipset (Sunrise Point)
- Thermal design power (TDP) up to 95 W (LGA 1151)
- Support for both DDR3L SDRAM and DDR4 SDRAM in mainstream variants, using custom UniDIMM SO-DIMM form factor with up to 64 GB of RAM on LGA 1151 variants. Usual DDR3 memory is also supported by certain motherboard vendors even though Intel doesn't officially support it.
- Support for 16 PCI Express 3.0 lanes from CPU, 20 PCI Express 3.0 lanes from PCH (LGA 1151)
- Support for Thunderbolt 3 (Alpine Ridge)
- 64 to 128 MB L4 eDRAM cache on certain SKUs
- Up to four cores as the default mainstream configuration
- Intel MPX (Memory Protection Extensions)
- Intel SGX (Software Guard Extensions)
- Intel Speed Shift
- Skylake's integrated Gen9 GPU supports Direct3D 12 at the feature level 12_1
- Full fixed function HEVC Main/8bit encoding/decoding acceleration. Hybrid/Partial HEVC Main10/10bit decoding acceleration. JPEG encoding acceleration for resolutions up to 16,000×16,000 pixels. Partial VP9 encoding/decoding acceleration.
|
|
| Model Number |
Cores |
Frequency |
Turbo-Quad |
L3 Cache |
GPU Model |
GPU Frequency |
TDP |
Socket |
Release Date |
Core i3
|
| Core i3-6100 |
2(4 Threads)
|
3.7 GHz |
N/A
|
3 MB |
HD 530 |
350–1050 MHz |
51 W |
LGA 1151 |
Oct,2015 |
Core i5
|
| Core i5-6400 |
4(4 Threads)
|
2.7 GHz |
3.1 GHz
|
6 MB |
HD 530 |
350–950 MHz |
65 W |
LGA 1151 |
Aug,2015 |
| Core i5-6600 |
4(4 Threads)
|
3.3 GHz |
3.6 GHz
|
6 MB |
HD 530 |
350–1150 MHz |
65 W |
LGA 1151 |
Sept, 2015 |
| Core i5-6600K |
4(4 Threads)
|
3.5 GHz |
3.6 GHz
|
6 MB |
HD 530 |
350–1150 MHz |
91 W |
LGA 1151 |
Aug, 2015 |
Core i7
|
| Core i7-6700 |
4(8 Threads)
|
3.4 GHz |
3.7 GHz
|
8 MB |
HD 530 |
350–1150 MHz |
65 W |
LGA 1151 |
Sept, 2015 |
| Core i7-6700K |
4(8 Threads)
|
4.0 GHz |
4.0 GHz
|
8 MB |
HD 530 |
350–1150 MHz |
91 W |
LGA 1151 |
Aug, 2015 |
Click here to return
|
|
|
April 2016 |
|
The 6th generation Intel® Core™ processor family is manufactured on Intel's latest 14 nm technology. Paired with the Intel® 100 series chipset, these processors offer dramatically higher CPU and graphics performance as compared to the previous generation, a broad range of power options, and new advanced features to boost performance for edge-to-cloud Internet of Things (IoT) designs. The 6th generation Intel Core processor family maintains a standardized thermal envelope for 65W and 35W desktop products remaining consistent with the previous processor generation and are an ideal low-power option for manufacturing flexibility.
The date of release and performance specification is shown in the table below.
"Skylake" (14 nm)
Skylake is the codename for the Intel® processor microarchitecture that is the successor to the Broadwell microarchitecture. Skylake is built on Intel’s 14 nm manufacturing process and delivers breakthroughs in performance and power efficiency over previous generation microarchitectures for high performance graphics, stunning high-resolution video playback, great system performance and responsiveness, even longer battery life, and stronger security.
The major changes between the Haswell and Skylake architectures include the removal of the fully integrated voltage regulator (FIVR) introduced with Haswell. On the variants that will use a discrete Platform Controller Hub (PCH), Direct Media Interface (DMI) 2.0 is replaced by DMI 3.0, which allows speeds of up to 8 GT/s.
Architecture:
- Improved front-end, deeper out-of-order buffers, improved execution units, more execution units(third vector integer ALU(VALU)), more load/store bandwidth, improved hyper-threading (wider retirement), speedup of AES-GCM and AES-CBC by 17% and 33% accordingly.
- 14 nm manufacturing process
- LGA 1151 socket for desktop processors
- 100 Series chipset (Sunrise Point)
- Thermal design power (TDP) up to 95 W (LGA 1151)
- Support for both DDR3L SDRAM and DDR4 SDRAM in mainstream variants, using custom UniDIMM SO-DIMM form factor with up to 64 GB of RAM on LGA 1151 variants. Usual DDR3 memory is also supported by certain motherboard vendors even though Intel doesn't officially support it.
- Support for 16 PCI Express 3.0 lanes from CPU, 20 PCI Express 3.0 lanes from PCH (LGA 1151)
- Support for Thunderbolt 3 (Alpine Ridge)
- 64 to 128 MB L4 eDRAM cache on certain SKUs
- Up to four cores as the default mainstream configuration
- Intel MPX (Memory Protection Extensions)
- Intel SGX (Software Guard Extensions)
- Intel Speed Shift
- Skylake's integrated Gen9 GPU supports Direct3D 12 at the feature level 12_1
- Full fixed function HEVC Main/8bit encoding/decoding acceleration. Hybrid/Partial HEVC Main10/10bit decoding acceleration. JPEG encoding acceleration for resolutions up to 16,000×16,000 pixels. Partial VP9 encoding/decoding acceleration.
|
|
| Model Number |
Cores |
Frequency |
Turbo-Quad |
L3 Cache |
GPU Model |
GPU Frequency |
TDP |
Socket |
Release Date |
Core i3
|
| Core i3-6100 |
2(4 Threads)
|
3.7 GHz |
N/A
|
3 MB |
HD 530 |
350–1050 MHz |
51 W |
LGA 1151 |
Oct,2015 |
Core i5
|
| Core i5-6400 |
4(4 Threads)
|
2.7 GHz |
3.1 GHz
|
6 MB |
HD 530 |
350–950 MHz |
65 W |
LGA 1151 |
Aug,2015 |
| Core i5-6600 |
4(4 Threads)
|
3.3 GHz |
3.6 GHz
|
6 MB |
HD 530 |
350–1150 MHz |
65 W |
LGA 1151 |
Sept, 2015 |
| Core i5-6600K |
4(4 Threads)
|
3.5 GHz |
3.6 GHz
|
6 MB |
HD 530 |
350–1150 MHz |
91 W |
LGA 1151 |
Aug, 2015 |
Core i7
|
| Core i7-6700 |
4(8 Threads)
|
3.4 GHz |
3.7 GHz
|
8 MB |
HD 530 |
350–1150 MHz |
65 W |
LGA 1151 |
Sept, 2015 |
| Core i7-6700K |
4(8 Threads)
|
4.0 GHz |
4.0 GHz
|
8 MB |
HD 530 |
350–1150 MHz |
91 W |
LGA 1151 |
Aug, 2015 |
Click here to return
|
|
|
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