|
M/BOARD Intel H61B3 MATX (REV 3.0) |
|
|
April 2011 |
Key Features
- GPU Boost
- EFI BIO
- EPU
- B3 Revision
Specifications
| CPU |
Intel® Socket 1155 for Intel® 2nd Generation Core™ i7 Processor/Core™ i5 Processor/Core™ i3 Processor/
Support Intel® 32nm CPU
Supports Intel® Turbo Boost Technology 2.0 |
| Chipset |
Intel® H61(B3) Express Chipset |
| Memory |
2 x DIMM, Max. 16 GB, DDR 1333/1066 Non-ECC,Un-buffered Memory
Dual Channel memory architecture |
| Expansion Slots |
1 x PCIe 2.0 x16
2 x PCIe 2.0 x1
1 x PCI |
VGA
|
Dual independent displays support: DVI and D-Sub
Supports Single-link DVI with max. resolution up to 1920x1200 @60Hz
Supports D-Sub with max. resolution up to 2048x1536 @75Hz
Supports Microsoft® DirectX 10.1
Intel® Quick Sync Video Technology Support |
| Storage |
Intel® H61(B3) Express Chipset
4 xSATA 3.0 Gb/s ports |
| LAN |
Realtek® 8111E Gigabit LAN controller |
| Audio |
Realtek® ALC887 8-Channel High Definition Audio CODEC |
| USB |
Intel® H61(B3) Express Chipset:
- 10 x USB 2.0/1.1 ports (4 ports at the mid-board, 6 ports at the back panel) |
| Back Panel I/O Ports |
1 x PS/2 Keyboard/Mouse Combo port
1 x DVI
1 x D-Sub
1 x LAN(RJ45) port(s)
6 x USB 2.0/1.1
3 x Audio jacks |
| Internal I/O Connectors |
2 x USB 2.0/1.1 connector(s) support additional 4 USB 2.0/1.1 ports
4 x SATA 3.0Gb/s
1 x CPU Fan connector(s)
1 x Chassis Fan connector(s)
1 x LPT connector
1 x S/PDIF Out connector
1 x 24-pin EATX Power connector
1 x 4-pin ATX 12V Power connector
1 x Front panel audio connector
1 x COM connector
1 x System Panel connector |
| Form Factor |
uATX Form Factor 9.6 inch x 8.0 inch ( 24.4 cm x 20.3 cm ) |
Click here to return
1AP8H61MLE
|
