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M/BOARD INTEL H61 B3 1155 MITX Print
May 2011
Key Features
  • GPU Boost - Go to the Limit with iGPU Level Up!
  • USB 3.0 - High Speed Transfer Technology
  • SATA 3.0Gb/s
  • EFI BIOS
  • B3 Revision
Specifications

CPU Intel® Socket 1155 for Intel® 2nd Generation Core™ i7 Processor/Core™ i5 Processor/Core™ i3 Processor Support Intel® 32nm CPU
Supports Intel® Turbo Boost Technology 2.0 
Chipset Intel® H61 Express Chipset
Memory 2 x DIMM, Max. 16 GB, DDR3 1333/1066 Non-ECC,Un-buffered Memory
Dual Channel memory architecture
Expansion Slots 1 x PCIe 2.0 x16
VGA Supports HDMI with Max. Resolution 1920 x 1200 @60Hz (under discussion)
Supports DVI with Max. Resolution 1920 x 1200 @60Hz
Supports D-Sub with Max. Resolution 2048 x 1530 @75Hz
Storage Intel® H61 Express Chipset
4 xSATA 3.0 Gb/s ports (blue)
LAN Realtek Gigabit LAN Controller
Audio 8-Channel High Definition Audio CODEC
USB Chipset built-in
- 2 x USB 3.0/2.0 ports
Chipset built-in
- 8 x USB 2.0/1.1 ports (4 ports at mid-board, 4 ports at back panel)
Back Panel I/O Ports 1 x PS/2 Keyboard/Mouse Combo port
1 x DVI
1 x D-Sub
1 x HDMI
1 x LAN(RJ45) port(s)
2 x USB 3.0/2.0
4 x USB 2.0/1.1
6 -Channel Audio I/O
Internal I/O Connectors 2 x USB 2.0/1.1 connector(s) support additional 4 USB 2.0/1.1 ports
4 x SATA 3.0Gb/s
1 x CPU Fan connector(s) (4pin)
1 x Chassis Fan connector(s) (4pin)
1 x S/PDIF Out connector
1 x 24-pin ATX Power connector
1 x 4-pin ATX 12V Power connector
1 x Front panel audio connector
1 x System Panel connector
1 x Clear CMOS jumper
Form Factor Mini ITX Form Factor
6.75 inch x 6.75 inch ( 17.1 cm x 17.1 cm )


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